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ReliaVia
Technology:
SAE Circuits, Colorado,
invented and trademarked the Reliavia process specifically
for SMT requirements. The Reliavia process increases
the reliability of solder joints and small hole
vias by 300% according to independent, outside testing.
The Reliavia process encaptulates the interconnects
of the plated through hole, preventing cracking
as a result of corrosion or Z-axis expansion. Additionally
it produces a consistently flat pad, significantly
enhancing solder paste application. Furthermore,
the flatter pads allow designers capability of using
finer pitch components.
SAE Circuits, Colorado
maintains ISO 9002 certification, standard 3 week
manufacturing leadtimes, current front-end engineering
formatting, JIT stocking programs, and quality
statistical analysis tracking.
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